Requisition Number: 74930

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Our Optical Communications segment has recently evolved from being a manufacturer of optical fiber and cable, hardware and equipment to being a comprehensive provider of industry-leading optical solutions across the broader communications industry.This segment is classified into two main product groupings – carrier network and enterprise network. The carrier network product group consists primarily of products and solutions for optical-based communications infrastructure for services such as video, data and voice communications. The enterprise network product group consists primarily of optical-based communication networks sold to businesses, governments and individuals for their own use.

For our location in Berlin, Germany, we are looking for a

Photonics Research Engineer – Connectivity for Integrated Optical Circuits (m/f/d)

Scope of Position:

Corning’s Optics Team is seeking an experienced Optomechanical Engineer to drive innovation in connector technology for optical communication.

You will join a collaborative group working at the intersection of advanced optics, electrical packaging and assembly, mechanical design and high-volume manufacturing to design, analyze and validate optomechanical components and assemblies for fiber optic connectors used in co-packaged optics, optical circuit boards, and optical backplanes.

• Develop precision optical and mechanical systems, leveraging skills in tolerancing, DFM (Design for Manufacturability), and integration.
• Explore novel assembly and packaging concepts for automated high-volume manufacturing. Combine opto-mechanical design with semiconductor manufacturing processes on wafer-level.
• Apply knowledge of optical alignment, mounting, and packaging concepts similar to those used in aerospace, medical device, semiconductor, automotive (LiDAR, ADAS), and scientific instrumentation industries.
• Evaluate, prototype, and test optomechanical solutions using CAD, FEA, and laboratory measurement tools.
• Collaborate with cross-functional teams in areas such as mechanical engineering, optical engineering, and manufacturing.
• Interface with vendors and suppliers to ensure component quality and manufacturability.

Day to Day Responsibilities:

• Innovate in the area of optical connectivity
• Coordinate design efforts with process and manufacturing engineers
• Instruct technicians how to perform required experiments
• Coordinate product evaluation with internal test labs
• Provide prototypes for and participate in voice-of-customer meetings
• Provide reliable solutions using analytical design and advanced problem-solving techniques
• Effectively communicate designs and performance data
• Meet project milestones and product cost targets

Required Education and Experience:

• BA, MS or PhD in Optical Engineering, Physics, Mechanical Engineering, or a related field.
• 2+ years of experience in optomechanical design for high-precision applications (e.g., telecommunications, aerospace, medical devices, semiconductor equipment, automotive sensors, or scientific instrumentation).
• Hands-on experience with the design and testing of optical assemblies, lens mounts, precision actuators, and alignment mechanisms.
• Demonstrated ability to solve challenging technical problems by developing creative solutions with an understanding of the underlying engineering principles.
• Demonstrated ability to collaborate in multidisciplinary teams and communicate complex technical concepts to diverse stakeholders.

Desired Skills:

• Knowledge of fabrication technologies such as precision machining and 3D printing
• Experience with optical setups including high precision alignment stages, power meters, tunable lasers, spectrum analyzers
• Proficiency in CAD tools (SolidWorks, Creo, or equivalent) and familiarity with FEA/thermal analysis.
• Programming skills for automated data acquisition and process controls using software such as LabVIEW and MATLAB
• Experience with adhesive technology
• Knowledge in clean room semiconductor process (deposition, etching, lithography) and electronic packaging (flip-chip assembly, wafer bonding, transfer printing)
• Understanding of cleanroom protocols, vacuum systems, or micro-assembly (as relevant to semiconductors, medical, or aerospace environments)